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  p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 1 10 0 v n - c hannel enhancement mode mosfet v oltage 10 0 v c urrent 2.2 a sot - 2 2 3 f eatures ? r ds(on) , v gs @10v,i d @ 2 .2 a< 310 m ? r ds(on) , v gs @ 4.5 v,i d @ 1 a< 320 m ? low on - resistance ? low input capacitance ? lead free in compliance wit h eu rohs 2011/65/eu directive ? green molding compound as per iec61249 std. (halogen free) m echanical data ? case : sot - 223 package ? terminals : solderable per mil - std - 750, method 2026 ? approx. weight : 0.043 ounces, 0.123 grams ? marking : w3n10 a m aximum r atings and t hermal c haracteristics (t a =25 o c unless otherwise noted) parameter symbol limit units drain - source voltage v ds 100 v gate - source voltage v gs + 2 0 v continuous drain current t a =25 o c i d 2. 2 a t a = 70 o c 1.7 pulsed drain current (note 1 ) i dm 4.4 a power dissipation t a =25 o c p d 3.1 w t a = 70 o c 2.0 operating junction and storage temperature range t j ,t stg - 55~150 o c typical thermal resistance - j unction to ambient , t Q (note 5 ) r ja 40.3 o c /w ? limited only by maximum junction temperature 1
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 2 e lectrical c haracteristics (t a =25 o c unless otherwise noted) parameter symbol test condition min. typ. max. units static drain - source breakdown voltage bv dss v gs =0v,i d =250ua 10 0 - - v gate threshold voltage v gs(th) v ds =v gs ,i d =250ua 1. 0 2.0 6 2.5 v drain - source on - state resistance r ds(on) v gs =10v,i d = 2.2 a - 2 84 310 m gs = 4.5 v,i d = 1.0 a - 28 7 320 zero gate voltage drain current i dss v ds = 8 0 v,v gs =0v - - 1 .0 ua gate - source leakage current i gss v gs = + 2 0v,v ds =0v - - + 100 n a dynamic (note 6 ) total gate charge q g v ds = 5 0 v, i d = 2.2 a, v gs = 10 v (note 1,2 ) - 9.1 - nc gate - source charge q gs - 2.1 - gate - drain charge q gd - 1.4 - input capacitance ciss v ds = 30 v, v gs =0v, f=1.0mhz - 508 - pf output capacitance coss - 2 9 - reverse transfer capacitance crss - 18 - turn - on delay time td (on) v dd = 50 v, i d = 2.2 a, v g s = 10v, r g = 6 (note 1,2 ) - 2 - ns turn - on rise time t r - 21 - turn - off delay time td (off) - 12 - turn - off fall time t f - 19 - drain - source diode maximum continuous drain - source diode forward current i s --- - - 2.2 a diode forward voltage v sd i s = 1 a,v gs =0v - 0. 78 1.2 v notes : 1. pulse width < 300us, duty cycle < 2% 2. essentially independent of operating temperature typical characteristics . 3. the maximum current rating is package limited. 4. repetitive rating, pulse width limited by junction temperature tj(max)=150c. ratings are based on low frequency and duty cycles to keep initial tj =25c. 5. r ? j a is the sum of the junction - to - case and case - to - ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. mounted on a 1 inch 2 with 2oz. square pad of copper . 6. guaranteed by design, not subject to production testing.
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 3 t ypical characteristic curves fig.1 output characteristics fig. 2 transfer characteristics fig. 3 on - resistance vs. drain current fig. 4 on - resist a nce vs. junction temperature fig. 5 on - resistance variation with vgs. fig. 6 source - drain diode forward voltage
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 4 t ypical characteristic curves fig. 7 gate - charge characteristics fig. 8 breakdown voltage variation vs. temperature fig. 9 threshold voltage variation with temperature fig. 10 capacitance vs. drain - source voltage fig. 11 maximum safe operating area
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 5 t ypical characteristic curves fig. 12 normalized transient thermal impedance vs. pulse width
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 6 packaging information . sot - 223 dimension u nit: mm
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 7 part no packing code version mounting pad layout part n o packing code package type packing type marking ver sion pj w3n10a _ r2 _00001 sot - 223 2.5k pcs / 13
p p j w3n10 a j ul y 7 ,201 5 - rev.0 0 page 8 disclaimer


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